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SunSeal DuploTEC 12410/20 SBF®

secure bonding solution for chip implanting

To safeguard sensitive information incorporated in smart cards against counterfeiting, tampering and unauthorized access. CT Lay offers SunSeal DuploTEC 12410/20 SBF® secure chip bonding solution. This state-of-the-art high-tech adhesive tape can be used with alternative card materials such as Parley Ocean Plastic®, PLA, R-PVC etc.

Your benefits :

  • Create secure and reliable connections between chip modules and antennas
  • Remain competitive by reducing energy costs and increasing output
  • Reduce the environmental footprint by using Lohmann’s solvent-free adhesive products that are activated at low temperatures
  • Excellent performance on recycled materials such as Parley Ocean Plastic®, rPETG and PLA) or rPVC

 

Product

Thickness

Main Features

DuploTEC® 12410 SBF

40 micron

Non-conductive

DuploTEC® 12420 SBF EC

65 micron
Anisotropic, electrically conductive

We help card manufacturers improve their production process while reducing supplier dependency and increasing output. With DuploTEC® SBF, we offer a solvent-free thermoset transfer film that is easy to use and can be electrically conductive in the z-direction. This film can be used on in-use equipment, making it an efficient and cost-effective solution for any card manufacturer.

SunSeal DuploTEC 12410/20 SBF® for use on recycled materials

We know how important it is to protect the environment and reduce environmental impact. That’s why our products are specifically designed for use on recycled materials. With DuploTEC® SBF, card manufacturers can reduce their environmental footprint while creating high-quality smart cards.

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Via Medicine 875 - 41057 San Vito di Spilamberto -  Modena - Italy

T. +39 059 799933 - F. +39 059 799880

P.IVA/VAT  IT02577750363 - SDI SUBM70N